DOWSIL 340 (142-Gram-Tube)

Additional Product Information

Key Technical Specifications

• Product Type: Thermally conductive silicone heat sink compound
• Appearance: Non-flowing grease-like compound
• Thermal Performance: Moderate thermal conductivity for efficient heat transfer
• Composition: Zinc oxide and polydimethylsiloxane
• Curing Requirement: No curing or oven processing required
• Function: Creates a thermal interface between heat-generating components and heat sinks
• Performance Benefit: Reduces thermal resistance and improves heat dissipation efficiency

Approvals & Specifications

• Engineered for thermal management applications in electronic and electrical assemblies
• Designed to maintain a positive heat sink seal for enhanced heat transfer performance
• Suitable for use in PCB and electronic device cooling applications

Typical Aircraft MRO & AOG Applications

• Thermal coupling of avionics components to heat sinks
• PCB assembly cooling and thermal management
• Electronic enclosure and chassis heat transfer applications
• Maintenance and repair of aircraft electronic systems
• Replacement of thermal interface materials during MRO activities
• Rapid thermal management solutions for AOG support requirements

Compatibility & Safety Notes

• Compatible with electrical devices, PCB assemblies, heat sinks, and chassis systems
• Designed to achieve thin bond line thicknesses (BLTs) for improved thermal performance
• Store in original packaging with the cover tightly secured to prevent contamination
• Use product before the expiration date indicated on the packaging label
• Follow applicable handling and safety procedures when working with silicone-based thermal compounds

Packaging & Procurement

• Supplied in sealed manufacturer packaging to maintain product integrity
• Ready to nuse formulation requiring no mixing or curing
• Available through authorized industrial and aerospace supply channels
• Store according to label instructions to maximize shelf life and performance

Why DOWSIL™ 340 Heat Sink Compound Is Chosen for MRO & AOG

• Provides reliable thermal coupling between electronic components and heat sinks
• No curing or oven processing reduces maintenance time and complexity
• Helps improve component reliability by efficiently removing excess heat
• Maintains thermal performance in compact, high-performance electronic systems
• Low bleed characteristics support long-term operational stability
• High temperature stability enhances performance in demanding environments

Alternative Names

• Thermally Conductive Heat Sink Compound
• Silicone Thermal Interface Compound
• Electronic Heat Transfer Grease
• PCB Thermal Management Compound
• Heat Sink Thermal Coupling Grease