Skip to main content

CHO-BOND-1075 (2.5-oz-Kit)

108160
ADHESIVE AND PRIMER(1086) (2.5-Ounce-Kit)

    Information

    CHO-BOND 1075 is a silver plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1075 is 0.010 inches (0.25mm). In addition, CHO-BOND 1075 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (100 psi) is required. The silver aluminum filler of CHO-BOND 1075 provides excellent galvanic corrosion resistance when applied to aluminum substrates. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1075 a good choice for a variety of commercial and military applications. CHO-BOND 1075’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.

    Specification

    Technical Specifications
    Expiry Date
    09/Apr/2023
    Manufacturer
    Parker Hannifin Ltd

    Downloads

    There are no download types with downloads for this product.

    Video

    No video available.

    Restrictions

    No restrictions set.

    You May Be Interested In

    No related products

    Recently Viewed

    No recently viewed products

    You May Be Interested In