HexPly F155 is an advanced modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness and adhesive properties. HexPly F155 is a controlled flow epoxy resin for lamination and co-curing at 250°F (121°C) cure. HexPly F155 will pass MIL-R-9300, co-cure as a honeycomb facing, and bond metal to metal.
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